We were one of the earliest providers of abrasives for chemical mechanical planarization (CMP) and we continue to deliver products that demonstrate a high level of performance and consistency.
Our fumed silica manufacturing technology, together with our statistical process control methods, have enabled us to further refine our products while offering consistent and reliable performance to the CMP industry. Additionally, our global manufacturing platform allows for manufacturing and technical support in Asia and North America.
As a planarization technique, CMP facilitates smooth, clean and planar surfaces by using carefully formulated fumed metal oxide dispersions in conjunction with specially designed equipment and pads.
The highly-controlled CMP process requires high purity fumed silica for the various dispersions and slurries. Our fumed silica products enable CMP formulators to:
CMP is primarily used in the fabrication of integrated circuits, where it enables the formation of multilayered structures with controlled thickness and planarity.
CMP is a complex process that poses several challenges.
CMP is continuously evolving and significant research is devoted to process optimization.